Vacuum Valves

TCT's vacuum valves are engineered to deliver exceptional sealing performance, durability, and cleanliness for critical vacuum applications across semiconductor, display, solar, and research industries.

Available in a variety of configurations—including angle valves, gate valves, inline Y valves, and transfer valves—our products support a wide pressure range from atmosphere to ultra-high vacuum (UHV).

Each valve is built with high-grade materials, precision-welded bellows, and low-outgassing materials to ensure long-term stability and minimal particle generation. Optional seal materials, such as FKM and FFKM, are available to accommodate corrosive or high-temperature environments.

Key features include:

  • L-motion or linear motion actuation for reduced friction and extended service life

  • Manual or pneumatic operation for system flexibility

  • Compact designs for space-limited integration

  • Customizable sizes and flanges to meet OEM specifications

  • Electropolished or glass-bead finishes for surface cleanliness

Whether isolating, transferring, or controlling vacuum flow, TCT valves provide reliable performance, easy maintenance, and proven purity in demanding production lines.

Angle Valves

Angle Valves

Angle Valves (Poppet Valves)

TCT offers high-performance vacuum angle valves in two configurations: the Angle Type and the Inline Y Type. These valves are commonly used as roughing or foreline pumping valves in vacuum systems.

General Features

  • Constructed from premium stainless steel with electropolished surfaces for low outgassing and corrosion resistance.
  • All valves use AM350 welded bellows for reliable vacuum sealing.
  • Available with optional FFKM poppet seals for chemically harsh processes.

1. Standard Series (50% Opening Orifice) - VP02, VP02M, VY02P, VY02M

  • Designed for general-purpose roughing and foreline applications.
  • Balanced performance between conductance and size.

2. High Conductance Series (100% Opening Orifice) - VP01, VY01

  • Longest bellows travel for maximum conductance.
  • Features bellows shielding to protect against corrosive gases and process powders.
  • Ideal for harsh processes with heavy particulate environments.

3. Compact Series (20% Opening Orifice) - VP04P, VP04M

  • Uses hydraulically formed soft bellows for high endurance and pressure resistance.
  • Designed for high-frequency operations in systems with significant pressure differentials.
  • Compact size with shorter travel distance for space-constrained setups.
Gate Valves

Gate Valves

TCT Gate Valves – High Vacuum & Ultra High Vacuum Isolation Solutions

TCT designs and manufactures reliable gate valves for both high vacuum and ultra high vacuum (UHV) environments. These valves are categorized by actuation mechanism and body material to suit various process requirements.

General Features

  • Construction: Stainless steel or aluminum body options
  • Sealing: Gate seals available in FKM or FFKM; bonnet seals include metal gaskets (OFHC copper) for UHV series
  • Mechanism Options: Available in linkage or linear motion designs
  • Applications: Semiconductor processing, ion implantation, plasma etching, and other high-vacuum technologies

1. High Vacuum Linkage Series – VG01P / VG01M

  • Classic linkage drive design with compact structure
  • Welded bellows feedthrough for high vacuum integrity
  • Manual or pneumatic actuation
  • Locking mechanism ensures stable operation under vibration
  • Ideal for general high vacuum isolation

2. Ultra High Vacuum Linkage Series – VG02P / VG02M

  • Enhanced for UHV systems with OFHC copper bonnet gasket
  • Polished internal surfaces minimize particle generation
  • Equipped with self-lubricating bearings and bushings for reduced friction
  • Suitable for cleanroom or ultra-clean vacuum environments

3. High Vacuum Linear Motion Series – VG03P / VG03M

  • Linear mechanism offers smoother motion and reduced wear
  • Bellows-sealed feedthrough minimizes external leakage
  • Available with FKM or optional FFKM sealing for aggressive gases
  • Ideal for applications needing high durability with fewer particulates

4. Lightweight High Vacuum Series (Aluminum Body) – VGA1P

  • Constructed with aluminum alloy for weight-sensitive systems
  • Designed for etching, implantation, and compact vacuum modules
  • Maintains high vacuum performance with reduced mass and footprint
Rectangular Door Valves

Rectangular Door Valves

VR01P Door Valve

The VR01P door valve is designed for use on vacuum chambers, enabling the transfer of substrates from atmosphere into vacuum environments.

  • TCT offers standard sizes tailored for the semiconductor industry, along with custom large-size options based on an L-motion design. This L-motion mechanism reduces friction and extends the service life of the O-ring.
  • Equipped with a secure locking mechanism, the valve ensures the door remains tightly sealed during operation.
  • Optional gate seal materials are available in both FKM and FFKM, allowing flexibility for various process requirements.
Retangular Transfer Valves

Retangular Transfer Valves

VD01P Series – Rectangular Transfer Valves

The VD01P series transfer valves are installed between two chambers to enable substrate transfer under vacuum conditions. TCT’s rectangular design allows for easy inline maintenance, eliminating the need to uninstall the valve from the system during part replacement.

  • Utilizing an L-motion mechanism, the valve minimizes friction and particle generation.
  • A position lock ensures secure operation, meeting the stringent requirements of the semiconductor industry
  • The actuator feedthrough is sealed with welded bellows, delivering ultra-low particle emission and outgassing rates—ideal for high-purity vacuum applications.
TOP